(1st November 2023, Hong Kong) The BOCHK Science and Technology Innovation Prize (STIP) announces the Laureates of 2023 today. “STIP in Artificial Intelligence and Robotics” is awarded to Prof. JIA Jiaya from the The Chinese University of Hong Kong. “STIP in Life and Health” is awarded to Dr. WONG Siu Lun Alan from The University of Hong Kong. “STIP in New Materials and New Energy” is awarded to Dr. TANG Jinyao from The University of Hong Kong. “STIP in Advanced Manufacturing” is awarded to Prof. CHEUNG Chi Fai Benny from The Hong Kong Polytechnic University. “STIP in FinTech” is awarded to the team of Prof. AU Man Ho Allen and Prof. LUO Xiapu Daniel from The Hong Kong Polytechnic University. The Laureates (individual/group) of each category will be awarded HK$ 2 million sponsored by the Bank of China (Hong Kong) Limited in recognition of their contributions in scientific research and influence on transformation of R&D outcomes in Hong Kong.
Laureate of STIP in Artificial Intelligence and Robotics
Prof. JIA Jiaya has spearheaded a research team in the development of a new generation of intelligent manufacturing platforms and highly automated manufacturing research and development systems, which drives the exploration of intelligent upgrading and digital transformation in the industrial manufacturing sector. As an expert in the fields of computer vision, artificial intelligence and computational imaging, Prof. JIA is a tenured Professor at The Chinese University of Hong Kong and the founder of Smartmore Corporation.
Laureate of STIP in Life and Health
Dr. WONG Siu Lun Alan’s groundbreaking gene editing tool screening platform has overcome the current limitations of one-by-one testing, enabling rapid identification of the most suitable and effective gene therapy tools and accelerating development of next-generation precision genome editors. Other screening platforms that he developed facilitates the interpretation of biological system complexity, leading to efficient screening of combination therapies for clinical applications. Dr. WONG is currently an Associate Professor at the Faculty of Medicine at the University of Hong Kong.
Laureate of STIP in New Materials and New Energy
Dr. TANG Jinyao has developed a novel type of light-responsive active colloidal material that achieves controllable photoinduced “phase separation”, leading to significant breakthroughs with potential applications in display technology and optical stealth materials. This advancement also contributes to the development of the fundamental theory behind light-controlled active materials and chemically driven micro/nano motors. In 2022, he developed a cluster system of nanorobots. Dr. TANG is currently an Associate Professor in the Department of Chemistry at the Faculty of Science at the University of Hong Kong.
Laureate of STIP in Advanced Manufacturing
Prof. CHEUNG Chi Fai Benny’s pioneering ultra-precision nano multi-ring machining technology has successfully been applied in the development of a novel and high-efficacy nano multi-ring defocus incorporated spectacle lens for myopia control, benefiting millions of myopic schoolchildren. Prof. CHEUNG serves as the Chair Professor of Ultra-precision Machining and Metrology in the Department of Industrial and Systems Engineering and the Director of the State Key Laboratory of Ultra-Precision Machining Technology at The Hong Kong Polytechnic University.
Laureates of STIP in FinTech
Prof. AU Man Ho Allen and Prof. LUO Xiapu have jointly developed new algorithms to protect the assets, system, and network security of the blockchain ecosystem, providing cryptographic foundations for blockchain technology. Their work has had a significant impact on the development of financial technology applications built on blockchain platforms. They are from the Department of Computing at the PolyU. Prof. AU's research focuses on information security and privacy protection, applied cryptography, blockchain technology, and its applications. Prof. LUO's research focuses on blockchain and smart contract security, software and system security, IoT and network security.
The BOCHK Science and Technology Innovation Prize, established in 2022 by the Hong Kong Alliance of Technology and Innovation and title sponsored by the Bank of China (Hong Kong) Limited, has received widespread support and enthusiastic nominations from universities, researchers, and innovative enterprises. The renowned scholars and experts from Hong Kong and overseas are invited every year to select the outstanding individuals or teams for recognizing their pioneering efforts and the application and transformation of research achievements for the benefit of the society. It’s an inspiration for scientific researchers and innovators in Hong Kong to persist in innovative exploration, establish themselves in Hong Kong, serve the nation, and contribute to the world.
Download poster and photos of laureates:
https://drive.google.com/drive/folders/1jQoZnpAJKHbeUK_r3HCVJWFyM9-4gpHM?usp=drive_link
Media Contact:
Mr. Hoi Shan Hsu
Deputy Secretary-General, Hong Kong Alliance of Technology and Innovation
Tel: 6199 1927 Email:
Ms. Emma Yang
Officer, Secretariat, BOCHK Science and Technology Innovation Prize
Tel: 2892 1267 Email: